Description
The High Power Card Edge (HPCE®) connector is a next
generationpower card edge
connector for demanding applica-tions requiringhigh linear current
density and low power loss.
HPCE offers a lowprofile height (7.50mm) and is based on very cost
effective andhighly reliable
stamped-and-formed power contact technologysimilar to other power
solutions from FCI.
HPCE® incorporates an innovative power contact and housingdesign
that permits a more compact and
lower profile packagefor demanding AC and DC power supply and/or
add-in cardapplications.
HPCE’s low profile height (for maximized airflow),significantly
increased linear current density and low
contactresistance characteristics are ideal for next generation
1U/2Uservers, storage enclosures,
telecommunications equipment anddatacom/networking equipment.
HPCE® is available with power and signal contacts integrated intoa
single molded housing for power
distribution and power control.Similar to other FCI power
solutions, HPCE® is modularly tooledmaking
the product highly configurable in terms of the numberand placement
of the power and signal contacts
for custom powerneeds.
HPCE® is rated to 9A per power contact beam (with multiple
powercontacts fully energized) without
exceeding a 30°C temperaturerise in still air. The innovative
design minimizes the connectorfootprint
and the robust housing includes touch-proof safetyfeatures as well
as polarization to ensure proper
mating. Verticaland right angle and straddle mount options are
available toaccommodate
various system architectures.
FEATURES
• Current rating to 9A/power contact beam (with multiple
powercontacts fully energized) without
exceeding a 30°Ctemperature rise in still air
• Low profile height (2.8mm for straddle mount; 7.50mm for
rightangle) maximizes airflow for effective
system cooling
• One-piece assembly enables cost-effective power deliveryfor 1U
and 2U power supplies or power
distribution applications
• Highly vented housing design maximizes heat dissipation
• Vertical, right angle and straddle mount options are available
withboth power contacts for power
distribution and signal contacts forpower control
• Number and placement of power and signal contacts are
highlyconfigurable for custom power needs
BENEFITS
●Enables users to upgrade systems for higher performance in the
same form factor
●Cost-effective solution yields low XT and Insertion Loss
●Drop in upgrade to previous generation systems
●Same product covers a wide range of customer applications
●0.5mm vias provide a drop-in replacement forVS parts
●Improved SI with the 0.4mm tails, same as V5e
●Can mix-and-match with other metric power and guidance components
to create the precise system
configuration that is needed
TECHNICAL INFORMATION
MATERIALS
• Contacts: High performance Copper Alloy
• Contact Finish:
• Performance-based plating at separable interface(Telcordia
GR-1217-CORE Central Office)
• Tin over Nickel on press-fit tails
• Tin-lead option
• Housings: High Performance Thermoplastic, 94-V0
• Plating GXT+™
ELECTRICAL PERFORMANCES
• Contact Resistance: ≤60 mΩ initial in backplaneapplication, ≤120
mΩ initial in coplanar application
• Current Rating (with ≤30°C temperature rise aboveambient): 0.5
A/contact with all contacts powered
• Insertion Loss Performance: see graph below
• Crosstalk Performance: see graph belowENVIRONMENTAL
• Telcordia GR-1217-CORE Central Office qualification
passedMECHANICAL PERFORMANCE
• Durability: 200 cycles• Mating Force: 0.50N max./contact
• Unmating Force: 0.15N min./contact• Average Compliant Pin
Insertion Force/pin:
• 0.4mm PCB hole: 15N max.
• 0.5mm PCB hole: 30N max.
• Polarized housing option ensures proper mating board orientation
• Plastic housing features and mounting ear options are
availablefor polarization to the host PCB
as well as to secure the connectorduring the wave solder process
TARGET MARKETS/APPLICATIONS
• AC/DC pluggable power supplies in data, telecom &datacom/networking
equipment
• Industrial PCs
• Industrial controls & instrumentation
• Medical
